
Description
MP-5050-810E Mid Power LED
Features
• High efficacy
• CRI Options: Minimum 70, 80 and 90
• Low thermal resistance
• Compatible with automatic placement equipment
• Compatible with infrared reflow solder process
Applications
• Replacement lamps
• Down lights
• Panel lighting
• Architectural lighting
Ordering Part Numbers1
|
Minimum CRI |
CCT |
Luminous Flux |
Ordering Part Number |
|
|
Minimum Flux (lm) |
Typical Flux (lm) |
|||
|
70 |
2700K |
182 |
209 |
MP-5050-810E -27-70 |
|
80 |
182 |
194 |
MP-5050-810E -27-80 |
|
|
90 |
156 |
167 |
MP-5050-810E -27-90 |
|
|
70 |
3000K |
200 |
221 |
MP-5050-810E -30-70 |
|
80 |
182 |
205 |
MP-5050-810E -30-80 |
|
|
90 |
164 |
178 |
MP-5050-810E -30-90 |
|
|
70 |
4000K |
220 |
233 |
MP-5050-810E -40-70 |
|
80 |
200 |
216 |
MP-5050-810E -40-80 |
|
|
90 |
172 |
186 |
MP-5050-810E -40-90 |
|
|
70 |
5000K |
220 |
233 |
MP-5050-810E -50-70 |
|
80 |
200 |
215 |
MP-5050-810E -50-80 |
|
|
90 |
172 |
186 |
MP-5050-810E -50-90 |
|
|
70 |
5700K |
220 |
233 |
MP-5050-810E -57-70 |
|
80 |
200 |
215 |
MP-5050-810E -57-80 |
|
|
90 |
172 |
186 |
MP-5050-810E -57-90 |
|
|
70 |
6500K |
220 |
230 |
MP-5050-810E -65-70 |
|
80 |
200 |
211 |
MP-5050-810E -65-80 |
|
|
90 |
172 |
183 |
MP-5050-810E -65-90 |
|
Binning Structure
Each mid power product shipped will be labeled with its specific flux and voltage bins. Not all bins listed are available in all CCTs and CRIs.
Flux Bins
|
Flux Bin |
Binning @ 45 mA, Tc= 25°C |
|
|
Minimum Flux (lm) |
Maximum Flux (lm) |
|
|
2J |
156 |
164 |
|
2K |
164 |
172 |
|
2L |
172 |
182 |
|
2M |
182 |
200 |
|
2N |
200 |
220 |
|
2P |
220 |
240 |
|
2Q |
240 |
260 |
Forward Voltage Bins1
|
Voltage Bin |
Binning @ 45 mA, Tc= 25°C |
|
|
Minimum Voltage (V) |
Maximum Voltage (V) |
|
|
1Q |
20 |
21 |
|
1R |
21 |
22 |
|
1S |
22 |
23 |
Absolute Maximum Ratings
|
Parameter |
Symbol |
Values |
Unit |
|
Forward Current |
If |
240 |
mA |
|
Pulse Forward Current |
Ifp |
300 |
mA |
|
Power Dissipation |
Pd |
5520 |
mW |
|
Reverse Voltage |
V r |
5 |
V |
|
Junction Temperature |
T j |
125 |
°C |
|
Operating Temperature Range |
T opr |
-40~+105 |
°C |
|
Storage Temperature Range |
T stg |
-40~+105 |
°C |
|
Soldering Temperature |
Tsld |
230 °C or 260 °C for 10 sec |
°C |
Characteristics1,2
|
Parameter (If= 45 mA, Tc= 25°C) |
Symbol |
Value |
Unit |
|
|
Forward Voltage |
Minimum |
Vf min |
21 |
V |
|
Typical |
Vf typ |
22 |
||
|
Maximum |
Vf max |
23 |
||
|
Reverse Current (Vr=5 V) |
I r |
10 |
uA |
|
|
Viewing Angle |
2θ1/2 |
115 |
° |
|
|
Thermal Resistance |
Rth J-S |
2 |
°C/W |
|
|
Electrostatic Discharge |
VESD |
1000 |
V |
|





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