NCSBE17A

Product Information

• Production Status：In production (Older model)
• Start of Sales：2019/11
• Packaging Quantity：6000 per reel

• Absolute Maximum Ratings at Tc=25°C.
• Irp conditions with pulse width ≤10ms and duty cycle <10%.

• Characteristics at Te=25°C
• Luminous Flux value as per CIE 127:2007 standard.
• Chromaticity Coordinates as per CIE 1931 chromaticity chart.
• The thermal resistance value (Rac) is used to perform logical analysis (e.g. computer-based thermal analysis simulation) andrepresents a thermal resistance between the die to the Tc measurement point (pcB used: Aluminum pcB t=1.5mm, Insulatinglayer t=0.12mm).
• For more details on thermal resistance, see CAUTIONS, (6) Thermal Management.

• Ranking at Tc=25°C
• Forward Voltage Tolerance:+0.05V
• Luminous Flux Tolerance:+6%
• Chromaticity Coordinate Tolerance:+0.006
• LEDs from the above ranks will be shipped. The rank combination ratio per shipment wil be decided by Nichia.

• This LED is designed to be reflow soldered to a PcB, if dip soldered or hand soldered, Nichia wil not quarantee its reliability.
• Reflow soldering must not be performed more than twice.
• When cooling the LEDs from the peak temperature a gradual cooling slope is recommended; do not cool the LEDs rapidly.
• During reflow soldering, the heat and atmosphere in the reflow oven may cause the optical charactenistics to degrade. In particularreflow soldering performed with an air atmosphere may have a greater negative effect on the optical characteristics than if anitrogen atmosphere is used; Nichia recommends using a nitrogen reflow atmosphere.
• This LED uses a silicone resin for the encapsulating resin; the silicone resin is soft, 1f pressure is applied to the silicone resin, itmay cause the resin to be damaged, chipped, delaminated and/or deformed. if the resin is damaged, chipped, delaminatedand/or deformed, it may cause the internal connection to fail causing a catastrophic failure (i.e. the LED not to iluminate) and/orreliability issues (e.g. the LED to corrode and/or to become dimmer, the color/directivity to change, etc.). Ensure that pressureis not applied to the encapsulating resin.
• Once the LEDs have been soldered to a PcB, it should not be repaired/reworked.
• When soldering, do not apply stress to the LED while the LED is hot.
• When using an automatic pick-and-place machine, choose an appropriate nozzle for this LED.
• The soldering pad pattern above is a general recommendation for LEDs to be mounted without issues; if a high degree of precisionis required for the chosen application (i.e. high-density mounting), ensure that the soldering pad pattern is optimized.
• When flux is used, it should be a halogen free flux, Ensure that the manufacturing process is not designed in a manner where theflux will come in contact with the LEDs.
• Ensure that there are no issues with the type and amount of solder that is being used.
• This ueD has all the electrodes on the backside: solder connections wil not be able to be seen nor confrmed by a normal viswainspection, Ensure that suficient verification is performed on the soldering conditions prior to use to ensure that there are noissues.

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