NF2E757GR
Pb-free Reflow Soldering Application，Built-in ESD Protection Device，RoHS Compliant
Description
- Absolute Maximum Ratings atTs=25°0
- Irp conditions with pulse width ≤10ms and duty cycle <10%.
- Characteristics at Ts=25°C,
- Luminous Flux value as per CIE 127:2007 standard.
- Chromaticity Coordinates as per CIE 1931 chromaticity Chart.
- Ras is Thermal Resistance from junction to Ts measuring point.2(Test board: FR4 board thickness=1.6mm, copper layer thickness=0.07mm)
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