TYF High Power LED Chip Ceramic 5050: Suitable For All Lighting Scenarios

With the rapid development of professional high-illuminance fields such as mobile lighting, automotive lighting, and drones, the market has set higher standards for the focusing ability, heat dissipation stability, and luminous efficiency of LED light sources. Traditional bracket-mounted LED chips struggle to balance high luminous efficiency and high power output, and issues such as light spot shadows, high-temperature light decay, and poor focusing have long constrained the performance of finished products. TYF introduces the High Power LED Chip Ceramic 5050, which uses advanced ceramic packaging technology combined with an innovative design of an extremely small light-emitting surface to systematically solve long-standing pain points in the industry, providing a high-performance light source solution for the high-precision professional lighting market.

The TYF High Power LED Chip 5050 uses a standard 5.0×5.0mm ceramic package and is available in both ball-head and planar designs. It boasts a luminous efficacy of >220lm/W at 350mA, a maximum power of 20W, a small 7mm² emitting surface, a color temperature range of 2700K-6500K, and selectable CRI (Ra) of 70/80/90/95. Operating at a standard 3V voltage, its low thermal resistance substrate ensures excellent heat dissipation, and it produces a uniform, shadow-free light spot. Specifically designed for professional lighting requiring small angles and high illumination, it is the preferred light source for mobile lighting, indoor and outdoor lighting, automotive lighting, drones, and other applications.

🔹High luminous efficiency and low power consumption, improved battery life

Measured luminous efficiency reaches 222 lm/W at a 350mA operating current, maintaining ultra-high luminous efficiency under low current conditions; even with a full load driving current of 6000mA, it still maintains a stable luminous efficiency of over 110 lm/W, significantly reducing power consumption and extending device battery life at the same brightness, especially suitable for battery-powered mobile devices.

🔹Ceramic low-resistance heat dissipation, stable and long-lasting High Power LED Chip

Utilizing a high thermal conductivity ceramic substrate and high-quality material packaging, the low thermal resistance (<0.6℃/W) effectively suppresses light decay, preventing color temperature drift and color difference expansion caused by high temperatures, significantly extending the lifespan of the light source.

🔹Extremely small light-emitting surface, uniform light spot without shadows

A 7mm² miniature light-emitting core, combined with an optimized phosphor coating process, results in extremely high light emission consistency. After lighting, the light spot is clean and uniform, without dark areas at the edges or black lines in the center. Perfectly adapted to narrow-angle lens solutions, easily achieving long-distance focused light and ultra-high center illuminance, completely solving common problems of yellow rings, black spots, and uneven brightness in high-power LED chips.

🔹Dual Packaging Form Factors + Multiple Specifications Available

The product offers both planar and spherical lens packaging structures, facilitating secondary optical design for various applications. Color temperatures cover the full spectrum from 2700K warm light to 6500K cool white light, and color rendering indexes can be customized from basic Ra70 to film-grade Ra95. A standard 3V voltage is compatible with most driver circuits, maximizing customization flexibility.

Application Scenarios - High Power LED Chip Ceramic 5050 Light Source Solution